CEI EN 61190-1-3:2007-11
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Fixing materials for electronic assembly Part 1-3: Requirements for electronic solders and for fluxed and non-fluxed solid solders used for soldering applications in electronics
Published date
01-11-2007
Publisher
Superseded date
12-08-2025
Superseded by
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This part of IEC/EN 61190 defines the requirements and test methods for fluxed and unfluxed rod, strip, and powder solder alloys other than solder paste for electronics soldering applications, and for special electronic-grade solder alloys.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| EN 61190-1-3:2007 | Identical |
| IEC 61190-1-3:2007 | Identical |
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