CEI EN 62047-2 : 2007
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS
Hardcopy , PDF
English
01-01-2007
FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
5 Test piece
6 Test report
Annex A (informative) - Test piece grip methods
Annex B (normative) - Testing conditions
Annex C (informative) - Test piece
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 [mu]m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1028. (09/2015)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62047-2:2006 | Identical |
| EN 62047-2:2006 | Identical |
| ISO 6892:1998 | Metallic materials — Tensile testing at ambient temperature |
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