CEI EN 62149-4 : 2011
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION
Hardcopy , PDF
English
01-01-2011
11-07-2025
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Symbols and abbreviated terms
4 Product parameters
5 Testing
6 Environmental specifications
Annex A (normative) - Sample size, sequencing and
grouping requirements
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the performance specification for 1300 nm fibre optic transceiver modules used for the ISO/IEC 8802-3 Gigabit Ethernet application.
| Committee |
CT 86
|
| DevelopmentNote |
Classificazione CEI 86-314. (09/2011)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 62149-4:2010 | Identical |
| EN 62149-4:2010 | Identical |
| IEC 60950-1:2005+AMD1:2009+AMD2:2013 CSV | Information technology equipment - Safety - Part 1: General requirements |
| EN 60825-1:2014/AC:2017-06 | SAFETY OF LASER PRODUCTS - PART 1: EQUIPMENT CLASSIFICATION AND REQUIREMENTS (IEC 60825-1:2014) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 61300-2-47:2016 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks |
| EN 60938-1:1999/A1:2007 | FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| EN 60950-1:2006/A2:2013 | INFORMATION TECHNOLOGY EQUIPMENT - SAFETY - PART 1: GENERAL REQUIREMENTS (IEC 60950-1:2005/A2:2013, MODIFIED) |
| ISO/IEC 8802-3:2000 | Information technology — Telecommunications and information exchange between systems — Local and metropolitan area networks — Specific requirements — Part 3: Carrier sense multiple access with collision detection (CSMA/CD) access method and physical layer specifications |
| IEC 60825-1:2014 | Safety of laser products - Part 1: Equipment classification and requirements |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 60938-1:1999+AMD1:2006 CSV | Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification |
| EN 60068-2-27:2009 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| EN 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
| EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
| EN 60749-26:2014 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| IEC 61300-2-47:2016 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks |
| EN 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
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