CEI EN IEC 61190-1-3:2018
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017)
Hardcopy , PDF
English
22-03-2019
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-5127-0
|
| Pages |
0
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61190-1-3:2017 | Identical |
| EN IEC 61190-1-3:2018 | Identical |
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