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DIN EN 60191-6-3:2001-06

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAT FLAT PACKS (QFP)

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2001

Defines a method for quad flat packs (QFP) measuring dimensions classified into Form E.

DevelopmentNote
Supersedes DIN IEC 47D-221-CDV (07/2001)
DocumentType
Standard
Pages
16
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Current

Standards Relationship
I.S. EN 60191-6-3:2001 Identical
NF EN 60191-6-3 : 2001 Identical
IEC 60191-6-3:2000 Identical
BS EN 60191-6-3:2001 Identical
EN 60191-6-3:2000 Identical

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