DIN EN 60191-6-8:2002-05
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2002
Foreword
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
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