DIN EN 61190-1-1:2003-01
Current
The latest, up-to-date edition.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
Hardcopy , PDF
German
01-01-2003
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
4.1 Conflict
4.2 Flux classification and testing
5 Quality assurance provisions
5.1 Responsibility for inspection
5.2 Classification of inspections
5.3 Materials inspection
5.4 Quality inspection
5.5 Performance inspection
5.6 Quality conformance
5.7 Preparation of fluxes for testing
6 Preparation for delivery
6.1 Preservation-packing and packaging
7 Additional information
7.1 Flux activity
7.2 Flux and cleaning relationship
7.3 Ordering data
Annex A (normative)
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Figures
Tables
Describes general requirements for the classifications and testing of soldering fluxes for high-quality interconnections in electronics assembly.
| DevelopmentNote |
Supersedes DIN IEC 91-141-CD (01/2003)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 61190-1-1:2002 | Identical |
| EN 61190-1-1:2002 | Identical |
| NF EN 61190-1-1 : 2002 | Identical |
| IEC 61190-1-1:2002 | Identical |
| I.S. EN 61190-1-1:2002 | Identical |
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