DIN EN 61190-1-3:2015-05 (Draft)
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Hardcopy , PDF
German
01-01-2015
07-03-2021
1 Scope
2 Normative references
3 Classification
3.1 Alloy composition
3.2 Solder form
3.3 Flux type
3.4 Flux percentage and metal content
3.5 Other characteristics
4 Terms and definitions
5 Requirements
5.1 Materials
5.2 Alloys
5.3 Solder forms
5.4 Flux type and form
5.5 Flux residue dryness
5.6 Spitting
5.7 Solder-pool
5.8 Labelling for product identification
5.9 Workmanship
6 Quality assurance provisions
6.1 Responsibility for inspection and compliance
6.2 Classification of inspections
6.3 Material inspection
6.4 Qualification inspection
6.5 Quality conformance
6.6 Preparation of solder alloy for test
7 Preparation for delivery
7.1 Preservation, packing, and packaging
Annex A (informative)
A.1 Intended use
A.2 Acquisition requirements
A.3 Standard solder product packages
A.4 Protocol for establishing short names for
IEC 61190-1-3 alloys
A.5 Standard description of solid solder products
Annex B (normative) Solder alloys
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
| DevelopmentNote |
Supersedes DIN IEC 91-149-CD. (01/2003) Supersedes DIN IEC 61190-1-3 and DIN IEC 61190-1-3:DRAFT AMD 1 issue 11-2008. (04/2011) DRAFT 2015 issued in May 2015. (05/2015)
|
| DocumentType |
Draft
|
| Pages |
72
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Superseded
|
| Supersedes |
| Standards | Relationship |
| I.S. EN 61190-1-3:2007 | Identical |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Identical |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Identical |
| BS EN 61190-1-3 : 2007 | Identical |
| EN 61190-1-3:2007/A1:2010 | Identical |
| VDE 0468-2-69 : 2018 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| DIN EN 60068-2-69 : 2007 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
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