DS/EN IEC 60749-37:2022
Current
Current
The latest, up-to-date edition.
Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
Published date
28-11-2022
Publisher
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This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
| Committee |
CLC/SR 47
|
| DocumentType |
Test Method
|
| PublisherName |
Danish Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 60749-37:2022 | Identical |
| IEC 60749-37:2022 | Identical |
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