I.S. EN 60749-22:2003
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH
Hardcopy , PDF
English
01-01-2003
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
FOREWORD
INTRODUCTION
1 Scope and object
2 Methods A and B (see also annex A)
3 Method C
4 Method D
5 Methods E and F
6 Method G: Wire ball shear test
7 Information to be given in the relevant specification
Annex A (normative) - Guidance
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