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I.S. EN 61189-6:2006

I.S. EN 61189-6:2006

Current

Current

The latest, up-to-date edition.

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2006

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
   3.1 Accuracy
   3.2 Precision
   3.3 Resolution
   3.4 Report
   3.5 Student's 't' distribution
   3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
   8.1 Test 6C01: Determination of acid value of liquid
        soldering flux - potentiometric and visual titration
        methods
   8.2 Test 6C02: Determination of halides in fluxes,
        silver chromate method
   8.3 Test 6C03: Solids content, flux
   8.4 Test 6C04: Quantitative determination of halide
        content in fluxes (chloride and bromide)
   8.5 Test 6C05: Qualitative analysis of fluorides and
        fluxes by spot test
   8.6 Test 6C06: Quantitative determination of fluoride
        concentration in fluxes
   8.7 Test 6C07: Acid number of rosin
   8.8 Test 6C08: Specific gravity
   8.9 Test 6C09: Determination of the percentage of flux on/in
        flux-coated and/or flux-cored solder
   8.10 Test 6C10: Flux induced corrosion (copper mirror method)
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12 X: Miscellaneous test methods
   12.1 Test 6X01: Determination of solder powder particle
        size distribution - Screen method for types 1-4
   12.2 Test 6X02: Solder powder particle size
        distribution-measuring microscope method
   12.3 Test 6X03: Solder powder particle size distribution -
        Optical image analyzer method
   12.4 Test 6X04: Solder powder particle size distribution -
        Measuring laser diffraction method
   12.5 Test 6X05: Determination of maximum solder powder
        particle size
   12.6 Test 6X06: Solder paste metal content by weight
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Presents a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
54
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN 61189-6:2006 Identical
NF EN 61189-6 : 2008 Identical
DIN EN 61189-6:2007-03 Identical
SN EN 61189-6 : 2006 Identical
IEC 61189-6:2006 Identical
BS EN 61189-6:2006 Identical
NBN EN 61189-6 : 2007 Identical

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
EN ISO 9001:2015 Quality management systems - Requirements (ISO 9001:2015)
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
ISO 9001:2015 Quality management systems — Requirements
EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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