I.S. EN IEC 60191-1:2018
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
24-04-2018
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Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General rules for all drawings
5 Additional rules
6 Inter-conversion of inch and millimetre dimensions
and rules for rounding off
7 Rules for coding
Annex A (informative) - Reference letter symbols
Annex B (informative) - Rules to specify the dimensions
and positions of terminals on a base drawing
Annex C (normative) - General philosophy of flat base devices
Annex D (normative) - Special rules for SMD-packages
Annex E (informative) - Examples of semiconductor
device drawings
Annex F (informative) - Former rules for rounding off
Annex G (informative) - Former rules for coding
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Provides guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. Supersedes I.S. EN 60191-1. (04/2018)
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| DocumentType |
Standard
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| PublisherName |
National Standards Authority of Ireland
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| Status |
Current
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| Standards | Relationship |
| IEC 60191-1:2018 | Equivalent |
| BS EN IEC 60191-1:2018 | Equivalent |
| DIN EN IEC 60191-1:2018-10 | Equivalent |
| IEC 60191-1:2007 | Identical |
| EN IEC 60191-1:2018 | Equivalent |