IEC 60191-4:2013+AMD1:2018 CSV
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Hardcopy , PDF
English - French
27-03-2018
IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
| DocumentType |
Standard
|
| Pages |
152
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
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