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IEC 60352-5:2012

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

Available format(s)

Hardcopy , PDF

Published date

22-02-2012

Superseded date

31-12-2021

Superseded by

IEC 60352-5:2020

£235.47
Excluding VAT
Summarise this standard

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
5 Tests
Annex A (informative) - Practical guidance
Bibliography

IEC 60352-5:2012 is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. The press-in connection consists of a termination having a suitable press-in zone which is inserted into a plated-through hole of a double-sided or multilayer printed board. Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of press-in connections under mechanical, electrical and atmospheric conditions as specified by the manufacturer of the press-in termination and to provide a means of comparing test results when the tools used to make the connections are of different designs or manufacture. This fourth edition cancels and replaces the third edition published in 2008. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- enhancement of Annex A and further application remarks are added;
- editorial changes throughout the standard to prevent the document from being misunderstood as specification for establishing press-in connection in total;
- deletion of all tables with hole dimensions. Historically the hole dimensions were constrained because of the dimensions of the wire wrap and clip connections posts. Since these connection technologies are no longer commonly used, the design requirements are no longer practical;
- inclusion of additional figures and one table in 4.4.4 to define tolerance ranges for holes in test-boards and to illustrate them;
- inclusion of a requirement for the thickness of the test-board in 4.4. The contents of the corrigendum of September 2014 have been included in this copy.

Committee
TC 48/SC 48B
DevelopmentNote
Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
66
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

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£235.47
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