IEC 60748-22-1:1997
Current
The latest, up-to-date edition.
Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
Hardcopy , PDF
English - French
10-04-1997
1 Characteristics and conditions of use
2 Recommended methods of mounting
3 Marking
4 Ordering information
5 Certified records of released lots
6 Additional information
7 Additional or increased severities or requirements
to those specified in the generic and/or sectional
specification
8 Inspection requirements (see tables 2 and 3 or 4
and 5)
9 Supplement - Tables of method B
Tables
1 Where a range of circuits
2 Method A - Groups A and B - Lot-by-lot
3a Method A - Group C - Periodic tests
3b Method A - Group D - Periodic tests
4a Method B - Group A - Lot-by-lot
4b Method B - Group B - Lot-by-lot
5a Method B - Group C - Periodic tests
5b Method B - Group D - Periodic tests
| Committee |
TC 47/SC 47A
|
| DevelopmentNote |
Also numbered as BS QC760201(1997). (09/2003) Supersedes IEC 60186B. (07/2004) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
29
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN IEC 60748-22-1 : 1998 | Identical |
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