IEC 61964:1999
Current
The latest, up-to-date edition.
Integrated circuits - Memory devices pin configurations
Hardcopy , PDF
English - French
30-04-1999
Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Pin Configurations Catalogue
4.1 Integrated Circuit Dynamic Read/Write Memories
4.2 Integrated Circuit Synchronous Dynamic Read/Write
Memories
4.3 Integrated Circuit Static Read/Write Memories
4.4 Integrated Circuit Read-Only Memories
4.5 Integrated Circuit Programmable Read-Only Memories
4.6 MOS Ultraviolet Light Erasable and Programmable
Read-Only Memories
4.7 Integrated Circuit Electrically Erasable and
Programmable Read-Only Memories
4.8 Memory Modules Comprising Integrated Circuit Memories
Annex A (informative) Bibliography
Table 1 - Nibble wide organization DRAM
Table 2 - Byte wide organization DRAM
Table 3 - Word wide organization DRAM (1)
Table 4 - Word wide organization DRAM (2)
Table 5 - Nibble wide organization SDRAM
Table 6 - Byte wide organization SDRAM
Table 7 - Word wide organization SDRAM
Applies to pinout package configurations of solid state integrated circuit memory devices. The purpose of this standard is to establish a registration procedure for such configurations.
| Committee |
TC 47/SC 47A
|
| DevelopmentNote |
Also numbered as BS EN 61964 (05/2005) Stability date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
39
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61964 : 2000 | Identical |
| NEN EN IEC 61964 : 1999 | Identical |
| I.S. EN 61964:2000 | Identical |
| PN EN 61964 : 2002 | Identical |
| EN 61964:1999 | Identical |
| DIN EN 61964:2000-01 | Identical |
| UNE-EN 61964:1999 | Identical |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60748-1:2002 | Semiconductor devices - Integrated circuits - Part 1: General |
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