IPC 4203B : 2018
Current
The latest, up-to-date edition.
Cover and Bonding Material for Flexible Printed Circuitry
Hardcopy
English
01-03-2018
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.
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