Name: IPC-7095E:2024 - Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
Brand: IPC by Global Electronics Association

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Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)

Available format(s)

PDF

Language(s)

English

Published date

09-12-2024

Publisher

IPC by Global Electronics Association

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Excluding VAT

The IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.

DocumentType	Standard
ISBN	978-1-63816-179-0
Pages	208
PublisherName	IPC by Global Electronics Association
Status	Current
Supersedes	IPC-7095D:2018 IPC-7095D:2018+AMD 1:2019 IPC-7095D-WAM1:2018/AMD 1:2019