IPC-JEDEC-9702:2004+AMD 1:2015
Current
Current
The latest, up-to-date edition.
Monotonic Bend Characterization of Board-Level Interconnects
Available format(s)
PDF
Language(s)
English
Published date
18-08-2015
Publisher
Excluding VAT
This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations.
| DocumentType |
Standard
|
| ISBN |
978-1-61193-191-4
|
| Pages |
16
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| Supersedes |
Summarise