IPC/JEDEC J-STD-033:1999
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Standard for Handling, Packing, Shipping andUse of Moisture/Reflow Sensitive Surface Mount Devices
Available format(s)
PDF
Language(s)
English
Published date
01-04-1999
Publisher
Superseded date
28-04-2026
Superseded by
Excluding VAT
This standard applies to all nonhermetic SMDs subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other packages made with moisture-permeable polymeric materials (epoxies, silicones, etc.) that are exposed to the ambient air.
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
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