IPC TR 486 : 0
Current
Current
The latest, up-to-date edition.
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presenceof Inner-Layer Separations
Available format(s)
PDF
Language(s)
English
Published date
01-07-2001
Publisher
Excluding VAT
Provides full detail of the round study charged with assessing the use of IST as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes.
| DevelopmentNote |
Included in IPC C 105 & IPC C 1000. (08/2008)
|
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
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