IPC WHITE PAPER AND TECHNICAL REPORT ON THE USE OF HALOGENATED FLAME RETARDANTS IN PRINTED CIRCUIT BOARDS AND ASSEMBLIES

Available format(s)

Hardcopy

Language(s)

English

Published date

19-09-2007

Publisher

Institute of Printed Circuits

Specifies the IPC position on the subject of 'halogen free' materials for the electronics industry. Applicable to materials for interconnecting electronics including but not limited to copper-clad laminates and prepregs, resin coated copper foils, flexible materials and soldermasks.

Committee	4-30
DevelopmentNote	Included in IPC C 107. (06/2008) Included in IPC C 105 & IPC C 1000. (08/2008)
DocumentType	Standard
Pages	33
PublisherName	Institute of Printed Circuits
Status	Current

IEC PAS 63015:2016	Definition of "Low-Halogen" for electronic products
PD IEC/PAS 63015:2016	Definition of “Low-Halogen?? for electronic products

IPC 4101 : D	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC E 500 : LATEST	IPC ELECTRONIC DOCUMENT COLLECTION

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IPC WP/TR 584 : A

IPC WHITE PAPER AND TECHNICAL REPORT ON THE USE OF HALOGENATED FLAME RETARDANTS IN PRINTED CIRCUIT BOARDS AND ASSEMBLIES

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