ISO/TS 10303-1685:2018
Current
The latest, up-to-date edition.
Industrial automation systems and integration — Product data representation and exchange — Part 1685: Application module: Interconnect module to assembly module relationship
Hardcopy , PDF
English
18-12-2018
ISO/TS 10303-1685:2018-11 specifies the application module for Interconnect module to assembly module relationship.
The following are within the scope of ISO/TS 10303-1685:2018-11:
- assembly requirement for interconnect substrate;
- assembly component based symbol placement in substrate requirement;
- assembly component based annotation text placement in substrate requirement;
- assembly component feature to layout feature requirement relationship;
- external references for assembly component;
- external references for assembly component feature;
| Committee |
ISO/TC 184/SC 4
|
| DocumentType |
Technical Specification
|
| Pages |
0
|
| PublisherName |
International Organization for Standardization
|
| Status |
Current
|
| Supersedes |
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