JEDEC JEP30-A100A:2023
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements
Hardcopy , PDF
English
01-03-2023
05-04-2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| Committee |
JC-14.4
|
| DocumentType |
Standard
|
| Pages |
40
|
| ProductNote |
This standard also refers toJEP30-A101,JEP30-D10,IPC-T-50,IPC-CH-65
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| JEDEC JEP30-S100A.02:2025 | Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30D:2024 | Part Model Guidelines for ElectronicDevice Packages – XML Requirements |
| JEDEC JEP 30:2018 | Part Model Guidelines for Electronic-Device Packages – XMLRequirements |
| JEDEC JESD30J:2022 | Descriptive Designation System for Electronic-device Packages and Footprints |
| J-STD-075:2008 | Classification of Non-IC Electronic Components for Assembly Processes |
| JESD22-A111B:2018 | Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices |
| IPC J STD 020E:2015 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
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