JEDEC JEP30-PX100A:2026
Current
The latest, up-to-date edition.
PartModel Product Guidelines for Electronic-Device Substrates and Assemblies – XML Requirements
Hardcopy , PDF
English
01-08-2026
The JEP30 document establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Revision
|
| Pages |
40
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
| JEDEC JEP 30-T100:2018 | PART MODEL THERMAL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES - XML REQUIREMENTS |
| JEDEC JEP 30-A100 : 2018 | Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-Q100:2026 | PartModel QualificationData -Guidelines for Electronic-Device Packages – XML Requirements |
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