JEDEC JESD 51-9:2000
Current
The latest, up-to-date edition.
Test Boards for Area Array Surface Mount Package Thermal Measurements
Hardcopy , PDF
English
01-07-2000
This specification is meant to be broad enough to incorporate a wide variety of surface mount area array package (e.g., BGA) design features and technologies.
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| CEI EN IEC 60749-10:2022 | Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly |
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