JEDEC JESD22-A111C:2025
Current
The latest, up-to-date edition.
Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices
Hardcopy , PDF
English
01-05-2025
This evaluation procedure is written to provide users of ICs in small surface mount packages with a method to evaluate the capability of a device to withstand full wave solder immersion.
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
| IPC J STD 033C:2012 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| JEDEC JESD625C:2022 | REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES |
| JEDEC JESD 22-A120B:2014 | TEST METHOD FOR THE MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED IN ELECTRONIC DEVICES |
| IPC J STD 035 : 0 | ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
| JEDEC JESD22-A113I : 2020 | Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing |
| IPC J STD 020D-1:2008 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
| JEDEC JESD47L:2022 | Stress-Test-Driven Qualification of Integrated Circuits |
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