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JIS C 0054:1994

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Environmental testing Part 2: Tests -- Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

Available format(s)

PDF

Language(s)

English

Published date

30-04-1994

Superseded date

20-11-2020

Superseded by

JIS C 0054:2002

£13.96
Excluding VAT

This Standard provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of SMD. The procedures use a solder bath and are applicable only to SMD that is designed to withstand short-term immersion in molten solder.

DocumentType
Standard
Pages
0
ProductNote
Japanese PDF version unavailable from Intertek Inform.
PublisherName
Japanese Standards Association
Status
Superseded
SupersededBy

Standards Relationship
IEC 60068-2-58:1989 Identical

£13.96
Excluding VAT