JIS C 0099:2005
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
English
20-03-2005
11-06-2025
This Japanese Industrial Standard specifies the methods for testing the solderability of the metal terminal or the electrode of the surface mounting devices mounted on a printed wiring board by wetting balance using lead-free solder paste.
| DocumentType |
Standard
|
| Pages |
31
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Superseded
|
| SupersededBy |
| JIS Z 3284:1994 | Solder paste |
| JIS K 0066:1992 | Test methods for distillation of chemical products |
| JIS H 3100:2006 | Copper and copper alloy sheets, plates and strips |
| JIS C 60068-2-54:1996 | Environmental testing Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method |
| JIS K 0068:2001 | Test methods for water content of chemical products |
| JIS K 5902:1969 | Colophonium |
| JIS K 0114:2000 | General rules for gas chromatographic analysis |
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS K 0064:1992 | Test methods for melting point and melting range of chemical products |
| JIS C 60068-2-20:1996 | Basic environmental testing procedures Part 2: Tests. Test T: Soldering Part 2: Tests. Test T: Soldering |
| JIS C 5602:1986 | Glossary of passive components for electronic equipment |
| JIS K 0067:1992 | Test methods for loss and residue of chemical products |
| JIS K 0070:1992 | Test methods for acid value, saponification value, ester value, iodine value, hydroxyl value and unsaponifiable matter of chemical products |
| JIS C 60068-2-58:2006 | Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| JIS C 60068-1:1993 | Environmental testing Part 1: General and guidance Part 1: General and guidance |
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