JIS C 5630-18:2014
Current
Current
The latest, up-to-date edition.
Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials
Published date
22-12-2014
Publisher
Sorry this product is not available in your region.
| DocumentType |
Standard
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62047-18:2013 | Identical |
2014 [22/12/2014]
Summarise
Sorry this product is not available in your region.