JIS C 60068-2-58:2016
Current
Current
The latest, up-to-date edition.
Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Amended by
Published date
20-12-2016
Publisher
Sorry this product is not available in your region.
| DocumentType |
Standard
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
2016 [20/12/2016]2006 [25/03/2006]2002 [20/03/2002]94 [01/02/2000]
| JIS C 60068-2-21:2023 | Environmental testing -- Part 2-21: Tests -- Test U: Robustness of terminations and integral mounting devices |
| JIS C 5101-1:2023 | Fixed capacitors for use in electronic equipment -- Part 1: Generic specification |
Summarise
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