Copper-clad laminates for printed wiring boards - Paper base, epoxy resin

Available format(s)

Hardcopy , PDF

Language(s)

Japanese, English

Published date

28-02-1997

Publisher

Japanese Standards Association

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This Japanese Industrial Standard specifies the copper-clad laminates for printed wiring boards using paper base, epoxy resin (hereafter referred to as "copper-clad laminates").

DocumentType	Standard
Pages	0
PublisherName	Japanese Standards Association
Status	Current

Reaffirmed 2015 97(R2015) [20/10/2015]97(R2010) [01/10/2010]97(R2001) [20/09/2001]97 [01/06/1997]91 [01/09/1991]86

JIS C 6481:1996	Test methods of copper-clad laminates for printed wiring boards
JIS C 6480:1994	General rules of copper-clad laminates for printed wiring boards

JIS Z 3851:1992	Standard qualification procedure for micro soldering technique
JIS C 5013:1996	Single and double sided printed wiring boards

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JIS C 6482:1997

Copper-clad laminates for printed wiring boards - Paper base, epoxy resin

Table of Contents

Abstract

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Standards Referenced By This Book

Standards Referencing This Book

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