MIL D 83532 : A (3) SUPP 1
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
DELAY LINES, ACTIVE
Published date
12-01-2013
Publisher
Superseded date
30-12-1991
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Covers requirements for fixed (tapped and untapped) pulse delay lines.
| Committee |
FSC 5999
|
| DocumentType |
Standard
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| MIL-STD-1837 Revision B:1991 | Miscellaneous Electrical and Electronic Components, Selection Guide (No S/S Document) |
| MIL D 83532/4 : A | DELAY LINES, 14 PIN DIP COMPATIBLE, 3 DELAY CIRCUITS PER PACKAGE |
| MIL D 83532/5 : (1) | DELAY LINES, ACTIVE, 16-PIN DIP COMPATIBLE, PROGRAMMABLE 3-BIT, TTL COMPATIBLE |
| MIL D 83532/1 : A | DELAY LINES, 14 PIN DIP COMPATIBLE, 5 TAP |
| MIL D 83532/3 : A | DELAY LINES, 14 PIN DIP COMPATIBLE, 10 TAP |
| MIL D 83532/2 : B | DELAY LINES, 14 PIN DIP COMPATIBLE, 5 TAP |
| MIL-M-55565 Revision C:1988 | MICROCIRCUITS, PACKAGING OF (S/S BY MIL-STD-2073/1) |
| MIL D 83532/6 : (1) | DELAY LINES, ACTIVE, 16-PIN DIP COMPATIBLE, PROGRAMMABLE 3-BIT, EMITTER-COUPLED LOGIC |
| MIL-STD-1772 Revision B:1990 | CERTIFICATION REQUIREMENTS FOR HYBRID MICROCIRCUIT FACILITIES AND LINES (S/S BY MIL-PRF-38534) |
| MIL-M-55565 Revision C:1988 | MICROCIRCUITS, PACKAGING OF (S/S BY MIL-STD-2073/1) |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
| MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| MIL-STD-1686 Revision C:1995 | Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices) (S/S by ANSI/ESD S20.20) |
| MIL-STD-45662 Revision A:1988 | Calibration Systems Requirements (Refer to ISO-10012-1 and ANSI-Z540-1 or Comparable Standards as Alternatives to MIL-STD-45662) |
| MIL-M-38510 Revision J:1991 | Microcircuits, General Specification for |
| J-W-1177 Revision B:1988 | WIRE, MAGNET, ELECTRICAL, GENERAL SPECIFICATION (S/S BY NEMA-MW1000) |
| MIL-STD-790 Revision G:2011 | Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEG. C) (S/S BY J-STD-004, J-STD-005 AND J-STD-006) |
| MIL S 19500 : J | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| MIL C 123 : B | CAPACITORS, FIXED, CERAMIC DIELECTRIC, (TEMPERATURE STABLE AND GENERAL PURPOSE), HIGH RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL H 38534 : B (1) | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| MIL C 55681 : D SUPP 1 | CAPACITOR, CHIP, MULTIPLE LAYER, FIXED UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-F-14256 Revision F:1993 | Flux, Soldering, Liquid, Paste Flux, Solder Paste and Solder-Paste Flux, (for Electronic/Electrical use), General Specification for (S/S by J-STD-004, J-STD-005 and J-STD-006) |
| MIL R 55342 : C | RESISTORS, FIXED, FILM, CHIP, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| MIL-STD-1285 Revision D:2004 | Marking of Electrical and Electronic Parts |
| MIL-STD-105 Revision E:1989 | Sampling Procedures and Tables for Inspection by Attributes (See Notice 3 for Replacement Information) |
Summarise
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