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NBN EN 62047-2 : 2007

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS

Published date

12-01-2013

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1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
  4.1 Method of gripping
  4.2 Method of loading
  4.3 Speed of testing
  4.4 Force measurement
  4.5 Elongation measurement
  4.6 Stress-strain curve
  4.7 Environment control
5 Test piece
  5.1 General
  5.2 Plane shape of test piece
  5.3 Test piece thickness
  5.4 Gauge mark
6 Test report
Annex A (informative) Test piece grip methods
Annex B (normative) Testing conditions
Annex C (informative) Test piece
Annex ZA (normative) Normative references to international
                      publications with their corresponding
                      European publications

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10[mu]m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.

DocumentType
Standard
PublisherName
Belgian Standards
Status
Current

Standards Relationship
DIN EN 62047-2:2007-02 Identical
EN 62047-2:2006 Identical
BS EN 62047-2:2006 Identical
I.S. EN 62047-2:2006 Identical

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