NEN EN IEC 60191-6-18 : 2010
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
Published date
12-01-2013
Publisher
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Gives standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
| DevelopmentNote |
Supersedes NEN NPR IEC/PAS 60191-6-18. (04/2010)
|
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60191-6-18:2010 | Identical |
| IEC 60191-6-18:2010 | Identical |
Summarise
Sorry this product is not available in your region.