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NEN EN IEC 60191-6-4 : 2003
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
Published date
12-01-2013
Publisher
Specifies the requirements for the measuring methods of ball grid array (BGA) dimensions.
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