NEN EN IEC 61188-5-2 : 2003
Current
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
Published date
12-01-2013
Publisher
Gives information on land pattern geometries used for the surface attachment of discrete electronic components. It provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and rework of resulting solder joints.
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