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NEN EN IEC 62047-18 : 2013

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS

Published date

23-10-2013

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Defines the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 [mu]m and 10 [mu]m.

DocumentType
Standard
PublisherName
Netherlands Standards
Status
Current

Standards Relationship
EN 62047-18:2013 Identical
IEC 62047-18:2013 Identical

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