NEN NPR IEC/TR 62258-7 : 2007
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
12-01-2013
Provides an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It also assists in the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers.
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