NF EN 60749-3:2017
Current
Current
The latest, up-to-date edition.
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
Published date
01-06-2017
Publisher
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The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.
| Committee |
TC 47
|
| DocumentType |
Test Method
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60749-3:2017 | Identical |
Summarise
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