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NF EN 61189-3-719 : 2016

Current

Current

The latest, up-to-date edition.

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING

Published date

15-12-2014

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DevelopmentNote
Indice de classement: C93-733-719. PR NF EN 61189-3-719 November 2014. (12/2014)
DocumentType
Standard
PublisherName
Association Francaise de Normalisation
Status
Current

Standards Relationship
EN 61189-3-719:2016 Identical
IEC 61189-3-719:2016 Identical

IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Sorry this product is not available in your region.