NF EN IEC 60749-37:2022
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Hardcopy
English - French
01-11-2022
This part ofIEC 60749provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components forhandheld electronic productapplications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
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