PD IEC/TR 62866:2014
Current
Current
The latest, up-to-date edition.
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
07-05-2014
Publisher
This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.