PN EN 60749-20 : 2010
Withdrawn
Withdrawn
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
Published date
12-01-2013
Publisher
Withdrawn date
14-06-2021
Sorry this product is not available in your region.
Summarise this standard
AI-generated summary
| Committee |
TC 60
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 60749-20:2008 | Identical |
| EN 60749-20:2009 | Identical |
Sorry this product is not available in your region.