RIAC PEM 2 : 1996

1.0 INTRODUCTION
2.0 VISIBILITY WITHIN THE MILITARY
    2.1 SHARP Workshops
    2.2 Microelectronics Quality Workshop
    2.3 PEM Specifications
    2.4 Microcircuit Application Handbook (MIL-HDBK-179)
    2.5 Fundamentals of Plastics Encapsulated Microcircuits
         (PEM) for Space Applications (Drafts)
    2.6 DESC Plastic Vendor Audits
    2.7 Reliability without Hermeticity (RwoH) Programs
    2.8 DLA/DoD Plastic Package Availability Program
    2.9 Army Evaluation/Use of Plastic Encapsulated Microcircuits
    2.10 Swedish - Bofors
    2.11 NASA - Lockheed Sealed Chip-on-Board (SCOB)
    2.12 Rome Laboratory (RL) Acquisition Reform Programs Support
3.0 COMMERCIAL
    3.1 Case Studies Symposium in the Successful Use of Commercial
         Integrated Circuits (ICs) in Military Systems
    3.2 Harris Report on PEM Reliability Considerations
    3.3 Stress Test Qualification for Automotive Grade Integrated
         Circuits
4.0 PEM EVALUATION PROCEDURES
    4.1 Thin Small-Outline Packages (TSOP)
    4.2 Internal Analysis Using Scanning Acoustic Microscopy
    4.3 Destructive Physical Analysis (DPA) Failure Analysis (FA)
         Procedure for PEMs
    4.4 PEM Decapsulation Procedure
    4.5 Bibliography for TSOP Technology
5.0 SUMMARY OF DATA COLLECTED
    5.1 Field Data
    5.2 Highly Accelerated Stress Test (HAST) Data
    5.3 AUTOCLAVE Data
    5.4 Life Test
    5.5 85 degree C/85% RH
    5.6 High Temperature Storage Data
    5.7 Temperature Cycling Data
    5.8 Infant Mortality Statistics
    5.9 Failure Modes/Mechanisms
    5.10 Solder Joint Reliability
    5.11 Hermetic vs. PEM Reliability
6.0 RELIABILITY MODEL
    6.1 Environment/Use Conditions
    6.2 Tailoring The Reliability Prediction
    6.3 Device Type Factor (II[TYPE])
    6.4 Operational Failure Rate
    6.5 Environmental Failure Rate
    6.6 Temperature Cycling Failure Rate
    6.7 Growth Factor (II[G])
    6.8 PEM Failure Rate Model Summary
    6.9 Prediction Example
    6.10 Model Assumptions and Limitations
    6.11 Model Analysis
7.0 REFERENCES
    7.1 Supplemental References
8.0 SUMMARY AND CONCLUSIONS
Appendix A: List of Acronyms
Appendix B: Plastic Encapsulated Microcircuit Conferences
Tables
Figures

Consists additional information on parts control/procurement, failure modes and mechanisms, and reliability/quality data on PEMs.