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RIAC SOAR 6U : 1998

Current

Current

The latest, up-to-date edition.

ELECTROSTATIC DISCHARGE CONTROL MFG.

Published date

12-01-2013

Chapter 1: ESD facility control requirements
1.0 Introduction
1.1 The nature of static electricity
1.2 Part damage due to ESD
1.3 The "ideal" ESD control program
1.4 ESD awareness training
Chapter 2: ESD control program tailoring
2.0 General criteria for program tailoring
2.1 Tailoring based upon part susceptibility
2.2 Tailoring based upon facility-dependent factors
2.3 Tailoring based upon location within the facility
2.4 Tailoring example
2.5 ESD control program tailoring references
Chapter 3: Protective materials and equipment
3.0 Introduction
3.1 Wrist straps and wrist strap testers
3.2 Protective work surfaces
3.3 Protective packaging
3.4 Ionization
3.5 Conductive floors, floor mats and footwear
3.6 Protective garments and clothing
3.7 Electrostatic detectors, field meters and monitors
3.8 Soldering iron protection
Chapter 4: Qualification/acceptance tests for ESD
           protective materials and program monitoring
4.0 Introduction
4.1 Product variability
4.2 Vendor selection and qualification
4.3 Material test and inspection procedures
4.4 ESD control program monitoring plan
4.5 Qualification/acceptance tests for ESD protective
     materials and program monitoring references
Appendices
A ESD video taps
B Electrical effectiveness of ESD protective bags
C EOS/ESD draft standard no. 1
Additional RAC services
Tables
1.1 Triboelectric series
1.2 An ideal ESD control program
2.1 Susceptibility classifications
2.2 ESD test standards that specify A HBM R-C network
2.3 Primary tailoring factors: device susceptibility
     classification
2.4 Secondary tailoring factors
2.5 Facility tailoring factors: location within the
     manufacturing facility
4.1 ESD test standards
4.2 ESD control qualification/certification/monitoring
     plan
Figures
1.1 ESD symbols
2.1 ESD control program tailoring flowchart
3.1 A typical wrist strap
3.2 Typical life test results
3.3 Surface resistivity at 55% RH and at 15% RH
3.4 Static decay times at 55% RH and at 15% RH
3.5 Surface resistivity change vs. RH
3.6 Static decay time change vs. RH
3.7 Typical dip tubes and IC carriers
4.1 Static decay time variability by lot
4.2 Faraday cup method of charge measurement
4.3 Test methods for evaluating ionizers

Outlines a detailed plan for development of an ESD control program in an ISO 9000 context. This plan can be applied to any manufacturing environment and to any electronic product.

DocumentType
Standard
PublisherName
The Reliability Information Analysis Center
Status
Current

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