SEMI 3D4 : 2015
Current
Current
The latest, up-to-date edition.
GUIDE FOR METROLOGY FOR MEASURING THICKNESS, TOTAL THICKNESS VARIATION (TTV), BOW, WARP/SORI, AND FLATNESS OF BONDED WAFER STACKS
Published date
28-07-2013
Gives examples of the capabilities and limitations of various measurement technologies applicable to BWS as well as their suitability for different applications.
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