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SEMI G38 : 2018

Current

Current

The latest, up-to-date edition.

TEST METHOD FOR STILL- AND FORCED-AIR JUNCTION-TO-AMBIENT THERMAL RESISTANCE MEASUREMENTS OF INTEGRATED CIRCUIT PACKAGES

Published date

12-01-2013

Describes junction-to-ambient measurements of thermal resistance and limits itself to still- and forced-air convection testing environments.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G32 : 1994(R2011) GUIDELINE FOR UNENCAPSULATED THERMAL TEST CHIP

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