SN EN 61188-1-2 : 1998
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 1-2: GENERIC REQUIREMENTS - CONTROLLED IMPEDANCE
12-01-2013
INTRODUCTION
1 Scope
2 Normative references
3 Engineering design overview
3.1 Device selection
3.2 Intraconnection
3.3 Printed board and printed board assemblies
3.4 Performance requirements
3.5 Power distribution
4 Design of controlled impedance circuits
4.1 Configurations
4.2 Equations
4.3 Controlled impedance design rules
4.4 Cross-talk rules
4.5 Coupon design rules
4.6 Decoupling/capacitor rules
5 Design for manufacturing
5.1 Process rules in CAD
5.2 Design complexity and correlation to cost
6 Data description
6.1 Details of construction
6.2 Isolation of data by net class (noise, timing,
capacitance and impedance)
6.3 Electrical performance
7 Material
7.1 Resin systems
7.2 Reinforcements
7.3 Prepregs, bonding layers and adhesives
7.4 Frequency dependence
8 Fabrication
8.1 General
8.2 Preproduction processes
8.3 Production processes
8.4 Impact of defects at high frequencies
8.5 Data description
9 Time domain reflectometry (TDR) testing
9.1 Rationale
Annex A Units, symbols and terminology
Annex ZA Normative references to international publications
with their corresponding European publications
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