UNE-EN 61191-3:2017
Current
The latest, up-to-date edition.
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
Hardcopy , PDF
English
01-10-2017
This part of IEC 61191 prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
| Committee |
CTN 203/SC 91-119
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-4397-8
|
| Pages |
30
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| I.S. EN 61191-3:2017 | Equivalent |
| BS EN 61191-3:2017 | Equivalent |
| IEC 61191-3:2017 | Identical |
| EN 61191-3:2017 | Identical |
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